Industrial Management in Microelectronics (M. Sc.)

Gain solid and fundamental knowledge

Bitte akzeptieren Sie funktionelle Cookies um den Inhalt zu sehen.

The production of micro and nano-electronic circuits and devices is a rapidly developing area with a high gradient of innovation. There are two challenges a leading engineer of chip and processor production is facing:
I) to be familiar with the latest developments in semiconductor technology and
II) to be able to organize the logistics of a rapidly changing production of circuits and devices with respect to both an efficient and low-cost production as well as to guarantee highest yields and quality.

Neither a manager of business administration nor an electronic engineer will be able to fulfill both requirements in sufficient quality. This program reflects the complexities and discovers the synergies by combining the competencies of engineers with those of managers in this field.

Students participating in this program will gain solid and fundamental knowledge in modern aspects of processor technology, packaging, microsystem and sensor technology as well as fundamental information on operations and logistics management and project management in semiconductor industry and related branches (see description of modules). Small study groups allow efficient and individual studying supported by intensive scientific care in theoretical and experimental exercises. Besides their scientific qualification the graduates will gain extended international and intercultural experience. Successful graduates of the program can start their career in different fields of the microelectronic industry, in companies dealing with microsystem and sensor technique and in all kinds of supply industries.

Overview of the study contents

First semester modules:

  • Circuits and Devices
    Basic principles and practical applications of analog and digital circuits
  • Semiconductor Technology I
    Basic principles of fabrication and miniaturization of semiconductor devices and circuits
  • Microsystems and Sensor Technology
    Analytical view as well as practical hands-on perspective on MEMS fabrication processes and overview on microsensors
  • Packaging in Microelectronics I
    Basic principles of electronic device assembly as well as circuit board and interposer fabrication
  • Operations and Logistics Management I
    Basic understanding of the different logistic subsystems, historical development, characteristics, aims and objectives as well as future logistic trends
  • Investment and Financing
    Basic principles of investment planning and investment decisions as well as basic understanding of uncertainty, risk, corporate financing, cash and credit management


Second semester modules:

  • Semiconductor Technology II
    In-depth understanding thermal processes , lithography and the interaction between physical fundamentals and function principles
  • Packaging in Microelectronics II
    Applying the knowledge of basic principles to microelectronic devices, printed circuit boards and electronic systems
  • Project Management
    Analytical view as well as strategic and practical hands-on perspective on operations and business processes
  • Operations and Logistics Management II
    In-depth understanding of different concepts to optimize logistic processes and models to calculate production and order lot sizes.
  • Masterthesis

Admission requirements

  • Bachelor’s Degree (4 years degree) in Electrical Engineering, Automation, Solid-State Physics, IT, Mechanical
    Engineering - 240 Credit Point
  • Average Grades Exceeding 70 %
  • Knowledge in English: IELTS 6.0 or TOEFL iBT 79 plus Oral and Written Interview
  • Motivation for International and Intercultural Experience
  • Minimum 1 year of work experience



  • Prof. Dr. Rainer Lasch
    Chair of Business Management, esp. Logistics, Technische Universität Dresden (TUD)

  • Prof. Dr. Gerald Gerlach
    Institute of Solid-State Electronics, Technische Universität Dresden (TUD)

  • Prof. Dr. Thomas Mikolajick
    Chair of Nanoelectronic Materials, Technische Universität Dresden (TUD)

  • Prof. Dr. Johann W. Bartha
    Former Chair Holder of the Institute of Semiconductors and Microsystems, Technische Universität Dresden (TUD)

  • Prof. Dr. Karlheinz Bock
    Chair of Electronic Packaging Technology, Technische Universität Dresden (TUD)

  • Prof. Dr. Thorsten Schmidt
    Chair of Material Handling, Technische Universität Dresden (TUD

  • Prof. Dr. Ulrike Stopka
    Chair of Information and Communication Business Management  Economics, Technische Universität Dresden (TUD)