Industrial Management in Microelectronics (M. Sc.)
Gain solid and fundamental knowledge.
Target group
- This course is designed for graduates who have work experience in the field of engineering and want to gain solid and fundamental knowledge in modern aspects of processor technology, packaging, microsystem and sensor technology as well as fundamental information on operations and logistics management and project management in semiconductor industry and related branches. Therefore, combining the competencies of engineers with those of managers in this field.
Advantages
Cooperation & Network
Overview of the study contents
Modul 1 - Circuits and Devices (5 ETCS)
Electronic circuits and devices:
- analog basic circuits
- differential amplifiers
- power amplifiers
- operational amplifiers and their applications
- power supply circuits and digital basic circuits
- combinatorial and sequential circuits
Modul 2 - Semiconductor Technology I / II (10 ETCS)
Fabrication technology of semiconductor device
- Semiconductor basics
- IC device and design
- Semiconductor manufacturing processes
Modul 3 - Microsystems and Sensor Technology (5 ETCS)
- Microsystem technology
- Sensor technology
Modul 4 - Packaging in Microelectronics I (5 ECTS)
- Trends in electronic packaging
- Packaging technologies for semiconductor devices and systems
- Thin-film & Thick-film technologies
- Printed circuit board (PCB) and interposer technologies
Modul 5 - Operations & Logistics Management I (5 ETCS)
- Logistics subsystem
- Aspects of process modelling and process
- performance
- Concepts to improve business processes
- Supply Chain Management
- Material requirement planning
Modul 6 - Investment and Financing (5 ETCS)
- Investment planning and investment decisions
- Methods and applications of investment appraisal
- Application of models under conditions of
- uncertainty
- Application of equity and debt financing
- Long-term and short-term financing and planning
Modul 7 - Semiconductor Technology II (5 ETCS)
- Basic principles of fabrication and miniaturization
- Thermal processes and lithography
- Interaction between physical fundamentals and function principles
Modul 8 - Packaging in Microelectronics II (3 ETCS)
- Surface technologies for electronic components
- Optical interconnections for printed circuit boards (PCBs) and interposer Praxistransfer und Supervision
Modul 9 - Operations & Logistics Management II (3 ETCS)
- Location and capacity planning
- Inventory management
- Scheduling techniques
Modul 10 - Project Management (4 ETCS)
- Introduction in project management
- Organization and structure of processes
- Application of different project management tools
- Application of project planning and time scheduling
- Design of cost and capacity oriented processes
- Control of projects including risk management
Master Thesis (15 ETCS)
- Thesis
- Kolloquium
Extracurricular Activities
- German Course
- Cultural Team Competences
- Scientific Working
Scientific Director
Prof. Dr. Rainer Lasch
Chair of Business Management, esp. Logistics, Technische Universität Dresden (TUD)
Prof. Dr. Gerald Gerlach
Institute of Solid-State Electronics, Technische Universität Dresden (TUD)
Lecturers (Extract)
Prof. Dr. Rainer Lasch
Chair of Business Management, esp. Logistics, Technische Universität Dresden (TUD)Prof. Dr. Gerald Gerlach
Institute of Solid-State Electronics, Technische Universität Dresden (TUD)Prof. Dr. Thorsten Schmidt
Chair of Material Handling, Technische Universität Dresden (TUDProf. Dr. Stefan Mannsfeld
Chair of Organic Devices, Center for Advancing Electronics Dresden (cfaed), Technische Universität Dresden (TUD)Prof. Dr.-Ing. habil. Thomas Zerna
Director of the Centre for Microtechnical Production, Electrical and Computer Engineering Department, Technische Universität Dresden (TUD)Prof. Dr. Mario Straßberger
University of Applied Sciences Zittau-Görlitz
Admission requirements
- Bachelor’s Degree (4 years degree) in Electrical Engineering, Automation, Solid-State Physics, IT - 240 Credit Points
- Average Grades Exceeding 70 %
- Knowledge in English: IELTS 6.0 or TOEFL iBT 79
- Motivation for International and Intercultural Experience
- Minimum: 1 year of work experience
Kompakt
- Degree:
- Master of Science (M.Sc.)
- Place of study:
- Dresden
- Start of study:
- 01. October 2025
- Duration:
- 2 semesters, 12 month incl. Master Thesis
- Credit points:
- 60 points
- program type:
- full time
- Tuition fee:
- 895 € per month
- Scholarship Database:
- Here you can find information on various kinds of DAAD funding for foreign students, graduates and postdocs as well as on funding offered by other selected organisations.
Personal advice
Personal advice
by our Indian Country Manager
DIU WhatsApp Counselling:
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Further information under WhatsApp Student Advisory Service.
flexible learning
The lectures take place for the most part in presence and online. Study materials are made available to students to enable asynchronous self-organized learning.
Lecture-free period phases during the summer and Christmas periods.
in-depth expert knowledge
The team of lecturers in the program includes both top-class scientists and experienced practitioners. In this way, well-founded information from science and research is combined with a high degree of practical relevance.
extensive exchange
Participants in this course come from a wide variety of fields and can greatly benefit from diverse learning groups, to expand their horizon. We offer interdisciplinary exchange in a relaxed atmosphere.