Advanced Packaging in Microelectronics - Part-time course
Electronic Packaging Expertise for Modern Microelectronic Systems
Gain a practice-oriented understanding of packaging technologies for semiconductor devices and systems, from bonding processes and circuit board fabrication to surface technologies and interposer solutions in microelectronics.
This course can be booked individually and is part of the Master's degree “Industrial Management in Microelectronics (M. Sc.)”.
Course Overview
- Trends in electronic packaging
- Packaging technologies for semiconductor devices and systems
- Thin-film & Thick-film technologies
- Printed circuit board (PCB) and interposer technologies
- Surface technologies for electronic components
- Optical interconnections for printed circuit boards and interposers
Our Continuing Education Program is designed for:
- Professionals with a recognized higher education entrance qualification and relevant professional experience in the semiconductor sector who want to refresh or deepen their knowledge
- Graduates with a first professionally qualifying university degree in a STEM field, such as mathematics, computer science, natural sciences, or engineering
- Students in STEM degree programs who want to expand their knowledge of microelectronics in a focused way
Participants are able:
- to understand the basic principles of electronic device assembly and of circuit board and interposer fabrication
- to understand the theoretical fundamentals of bonding technologies such as bonding, soldering, welding, and gluing, as well as subtractive and additive patterning techniques for circuit boards and interposers
- to apply this knowledge to microelectronic devices, printed circuit boards, and electronic systems.
Scientific Director
Overview
Degree
Participation without an exam: Certificate of Enrollment
Participation with an exam: ECTS Certificate
Credit Points8 ECTS with exam
Start
Fall 2026
Course Type
Part-time
Course LocationDresden, Online
Two online session per week
(i.e. 05:00 to 08:30 pm)
1 to 2 days per semester on-site kick-off sessionCourse Fee
€2,035 (VAT-exempt)
Admission Requirements
General admission requirements regulated in the examination regulations of the degree program must be fulfilled.
Literature recommendations can be provided in advance of the module, whose content is assumed known and/or whose content is to be acquired during the module.
