Advanced Packaging in Microelectronics - Full-time course
Electronic Packaging Expertise for Modern Microelectronic Systems
Gain a practice-oriented understanding of packaging technologies for semiconductor devices and systems, from bonding processes and circuit board fabrication to surface technologies and interposer solutions in microelectronics.
This course can be booked individually and is part of the Master's degree “Industrial Management in Microelectronics (M. Sc.)”.
Course Overview
- Trends in electronic packaging
- Packaging technologies for semiconductor devices and systems
- Thin-film & Thick-film technologies
- Printed circuit board (PCB) and interposer technologies
- Surface technologies for electronic components
- Optical interconnections for printed circuit boards and interposers
Objectives
Participants are able:
- to understand the basic principles of electronic device assembly and of circuit board and interposer fabrication
- to understand the theoretical fundamentals of bonding technologies such as bonding, soldering, welding, and gluing, as well as subtractive and additive patterning techniques for circuit boards and interposers
- to apply this knowledge to microelectronic devices, printed circuit boards, and electronic systems.
Scientific Director
Teaching format
The contents of the module are dealt with in the form of lectures, tutorial practices as well as self-study. For a better understanding of the contents, case studies in the form of group works are carried out.
Overview
Degree
Participation without an exam: Certificate of Enrollment
Participation with an exam: ECTS Certificate
(8 ECTS)Start
06 May 2026
Course Dates
06 May 2026
08 May 2026
11 May 2026
11 June 2026
18 June 2026
23 June 2026
02 July 2026
14 July 2026
16 July 2026
Course Type
Full-time
On-site (Dresden)Course Fee
€1,718 (VAT-exempt)
Our Continuing Education Program is designed for:
- Professionals with a recognized higher education entrance qualification and relevant professional experience in the semiconductor sector who want to refresh or deepen their knowledge
- Graduates with a first professionally qualifying university degree in a STEM field, such as mathematics, computer science, natural sciences, or engineering
- Students in STEM degree programs at TUD Dresden University of Technology who want to expand their knowledge of microelectronics in a focused way
Admission Requirements
General admission requirements regulated in the examination regulations of the degree program must be fulfilled.
Literature recommendations can be provided in advance of the module, whose content is assumed known and/or whose content is to be acquired during the module.
